【Dissimilar Jointing / Adhesive-Free Direct Joining】 Improved adhesion and hydrophilicity! Surface modification of carbon fibers using high-efficiency plasma. Cost reduction as well.
"Precise" is an atmospheric pressure plasma treatment that enhances surface hydrophilicity and adhesion by processing particles such as carbon fiber surfaces, chopped fibers, and carbon black. By sufficiently electrically isolating the plasma source from the treatment area, surface modification can be achieved without damaging the workpiece and without generating static electricity after treatment. Additionally, in applications for sizing pre-treatment, the rinsing and subsequent drying processes become unnecessary, contributing to significant cost reductions, as well as other benefits beyond surface modification. 【Examples of Applications and Their Effects】 ■ Cost reduction through improved adhesion in sizing pre-treatment ■ Anchor effect after sizing ■ Enhanced solubility and dispersibility characteristics in solutions through surface treatment of powders ■ Realization of dissimilar bonding and adhesive-free direct bonding *For more details, please refer to the materials. Feel free to contact us with any inquiries.
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**Advantages of Atmospheric Pressure Plasma Surface Modification** - No need for a drying process due to dry treatment (dry process). - Ability to control the desired contact angle. - All areas of active gas (OH radicals) can be treated. - Can be easily used as a plasma source for hydrophobic/reduction treatment, etching, and CVD equipment by adding various gases. - The equipment is compact (space-saving). - No post-treatment such as exhaust gas treatment is required for hydrophilic treatment. - No physical damage to the treated surface (downstream type). - No charging after treatment (downstream type). - No change in device performance even when treating semiconductor devices. - No UV damage to the surface during treatment. - No particle generation (downstream type). - Surface drying can be achieved without residue formation. - High-density generation of highly reactive oxygen radical particles allows for fast processing, contributing to increased productivity. - By changing the type of added gas, it is possible to select functional groups or amine groups suitable for the matrix material. - It is possible to enhance adhesion without losing the inherent effective electrical properties of liquid crystal polymers (LCP). - Direct bonding with low dielectric constant is possible since no adhesive is used. - Joining technology for similar and dissimilar materials through interface control.
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For more details, please refer to the materials. Feel free to contact us as well.
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We are expanding a new approach using dry processes to leverage the reliability of our equipment and various know-how cultivated through sales performance, applying its advantages to other markets (such as the battery market and particles) alongside process applications. Our downstream-type high-density plasma source (electrode) processing section is isolated from the workpiece, preventing any electrical or physical damage to the workpiece, and eliminating the effects of ultraviolet light generated during plasma creation. This allows for the only clean processing (particle-free) possible with atmospheric pressure plasma equipment. By changing the added gases, we can selectively impart molecular functionality, enabling interface control according to various surface materials as a processing technology. This is an effective means for direct adhesion, adhesion of dissimilar materials, and enhancing the adhesion of stronger coatings. The processing width (plasma width) can uniformly handle from 100mm to 3000mm. We can also accommodate carbon fiber bundles and fiber bundle shapes, allowing for uniform processing even within the bundles. Additionally, we can handle the same processing for particles. We manufacture tabletop experimental devices of the downstream type, conduct spot-type device experiments (starting from 2.5 million yen), and also carry out on-site experimental sample work.