An essential inspection tool that strongly supports the stabilization of device processes!
The "BMW-1200R" is an inspection tool that detects minute surface defects (such as chuck marks, discharge marks, dents, contact marks, etc.) occurring on the backside of wafers during the device manufacturing process with high sensitivity and speed. It quickly maps defect information that can lead to yield loss in subsequent processes such as exposure and CMP. Additionally, at the review station, three-dimensional automatic measurements of individual defects extracted from macro inspections are performed using a laser microscope, providing users with detailed data such as defect P-V values. 【Features】 ■ Full backside inspection (EE = 1mm) ■ Candidate defect extraction using image processing and masks ■ High throughput ■ Wide dynamic range ■ Automatic defect review and automatic 3D measurement *For more details, please refer to the catalog or feel free to contact us.
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【Merits】 ■ High sensitivity and speed in detecting micro surface defects ■ Quick mapping of defect information ■ Strong support for stabilizing device processes *For more details, please refer to the catalog or feel free to contact us.
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Optima Corporation is a company that sells semiconductor wafer inspection and measurement equipment. We mainly handle semiconductor inspection equipment, industrial machinery, used equipment, macro inspection, manufacturing equipment, polishing equipment, and cleaning equipment. We are here to meet your needs, so please feel free to contact us.