オプティマ Product Lineup

The "RXW Series" is a dedicated edge defect inspection device for silicon wafers that utilizes unique laser application technology along with sensor and image processing technology. It meets the diverse inspection, dimensional measurement, and automatic sorting requirements for edge proximity areas demanded in both wafer manufacturing and device manufacturing processes. We offer models such as the "RXW-1200D" and "RXW-1200F" that are compatible with device manufacturing processes. 【Features】 <RXW-1200D> ■ Full circumference image acquisition and ADC functionality using a laser sensor ■ Dark field switching function that enables high-sensitivity inspection ■ Border measurement function after EBR ■ Inspection and measurement after edge trimming, bonding, and sintering in CIS/TSV processes ■ ADR function with a high-magnification AF color camera *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

The "BMW Series" is an automatic inspection device that detects microscopic surface defects occurring on the backside of wafers during the device manufacturing process with high sensitivity and speed, quickly mapping defect information that can lead to yield loss in subsequent processes such as exposure and CMP. Additionally, in the review station, three-dimensional automatic measurements using a laser microscope are performed on candidate defects extracted from macro inspection, providing users with detailed data such as defect P-V values, contributing to process stabilization. 【Features】 ■ High sensitivity and speed in detecting microscopic surface defects (chuck marks, discharge marks, dents, contact marks, etc.) ■ Full backside inspection (EE=1mm) ■ Candidate defect extraction using image processing and masks ■ Wide dynamic range and high processing capability ■ Automatic defect review and 3D measurement using a confocal microscope *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

The "MO-601HS" is a wafer surface defect inspection device that enables measurement across the entire wafer, allowing for the identification of crystal defects near the active layer of Si wafers as foreign substances and surface roughness or scratches on the surface. It is possible to confirm defects with actual images through the viewer function, as well as analyze defects through TEM observation using the laser marking function. As a method for non-destructive evaluation of the breakdown voltage and reliability of oxide films, it is utilized for maintaining the quality of annealed wafers and others. 【Features】 ■ Fully automated measurement with an auto-loader ■ Compatible with 200mm and 300mm wafers ■ High sensitivity: capable of detecting defects as small as 200nm in diameter ■ Full mapping measurement function for defects, foreign substances, and haze ■ Raster scan method with constant measurement conditions *For more details, please refer to the catalog or feel free to contact us.

• Other inspection equipment and devices

The "EdgeScan G6" is a wafer edge inspection device that incorporates new mechanisms compatible with the BSI-CIS process and TSV process, which were not available in previous models. It covers all shape and dimension measurements and defect inspections in the edge vicinity area related to processes such as wafer bonding, trimming, and thinning. Utilizing unique laser application technology along with sensor and image processing technology, it strongly supports the stabilization of device processes. 【Features】 ■ Backside suction transport and measurement ■ Laser and line sensor image measurement ■ Metric Based Binning (ADC function) ■ Color review function ■ Multi-layer film boundary measurement using phase camera *For more details, please refer to the catalog or feel free to contact us.

• Other inspection equipment and devices

The "BMW-1200R" is an inspection tool that detects minute surface defects (such as chuck marks, discharge marks, dents, contact marks, etc.) occurring on the backside of wafers during the device manufacturing process with high sensitivity and speed. It quickly maps defect information that can lead to yield loss in subsequent processes such as exposure and CMP. Additionally, at the review station, three-dimensional automatic measurements of individual defects extracted from macro inspections are performed using a laser microscope, providing users with detailed data such as defect P-V values. 【Features】 ■ Full backside inspection (EE = 1mm) ■ Candidate defect extraction using image processing and masks ■ High throughput ■ Wide dynamic range ■ Automatic defect review and automatic 3D measurement *For more details, please refer to the catalog or feel free to contact us.

• Other inspection equipment and devices