Wafer Surface Defect Inspection Device "MO-601HS"

Fully automatic measurement with an auto-loader! Wafer surface defect inspection equipment.

The "MO-601HS" is a wafer surface defect inspection device that enables measurement across the entire wafer, allowing for the identification of crystal defects near the active layer of Si wafers as foreign substances and surface roughness or scratches on the surface. It is possible to confirm defects with actual images through the viewer function, as well as analyze defects through TEM observation using the laser marking function. As a method for non-destructive evaluation of the breakdown voltage and reliability of oxide films, it is utilized for maintaining the quality of annealed wafers and others. 【Features】 ■ Fully automated measurement with an auto-loader ■ Compatible with 200mm and 300mm wafers ■ High sensitivity: capable of detecting defects as small as 200nm in diameter ■ Full mapping measurement function for defects, foreign substances, and haze ■ Raster scan method with constant measurement conditions *For more details, please refer to the catalog or feel free to contact us.

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