Compact PC for machine, factory, and building automation.
Features ■ Width 210 × Height 71.6 × Depth 265 mm (AM210) 3.98 liters ■ Width 210 × Height 128.6 × Depth 265 mm (AM210-PE) 7.15 liters ■ 4th Generation Core i Desktop CPU ■ Fanless operation ■ DDR3 SO-DIMM Maximum 16GB ■ DVI-D, VGA, DP, HDMI output ■ 2 slots: PCI-E[x8]x1, PCI-E[x1]x1 (AM210AF/EF-PE) ■ 2x2.5" SATA HDD (AM210AF/EF-PE) ■ iSMART, iAMT (9.0)
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basic information
Specifications ■CPU: Socket LGA1150 4th Generation Core i7/i5/i3 Desktop ■Chipset: Q87PCH(MB210AF)/H81PCH(MB210EF) ■Memory: DDR3 SO-DIMM x 2 (up to 16GB) ■CPU Board: MB210AF/MB210EF ■Hard Disk: mSATA x 1, 2.5" HDD x 1 ■Expansion Slots: CFast x 1, Mini PCI-E x 2 ■I/O Connectors: G-LAN x 2 USB3.0 x 4, USB2.0 x 4 RS-232 x 3, RS-422/485 x 1 DVI-D x 1, VGA x 1, DisplayPort x 1, HDMI x 1 Audio Mic in/Line out ■Input Power: DC 12–24V ■Case: Aluminum, Steel ■Dimensions: 210mm(W) x 71.6mm(H) x 265mm(D) ■Operating Temperature: -10–45℃ (for 45W CPU) / -10–50℃ (for 35W CPU) ■Certification: CE, LVD, FCC Class B
Price information
Open price
Price range
P3
Delivery Time
P4
Applications/Examples of results
Machine, factory, building automation
Line up（3）
| Model number | overview |
|---|---|
| AMI210AF | 4th Generation Socket LGA1150 Core i CPU compatible, 4GB DDR3, 2.5inch 64GB industrial SSD |
| AMI210EF | 4th Generation Socket LGA1150 Core i CPU compatible, 4GB DDR3, 2.5inch 64GB industrial SSD |
| Option | CPU (i7-4770TE, i5-4570TE, i5-4590T, i3-4350T, i3-4330TE, G3320TE, G1820TE), AC adapter |
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Company information
Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.
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