High-performance insulating adhesive film for electronic components and modules

Thin-film, high-insulation adhesive film that responds to the "thinning" and "miniaturization" of semiconductors and passive components!

The "High-Performance Insulating Adhesive Film for Electronic Components and Modules" is a product of Namix, a company engaged in the research, development, manufacturing, and sales of electrochemical materials, under the trademark "Adofrema." It is a thermosetting resin film in an unreacted state that features low dielectric constant and low dielectric loss tangent, making it ideal for GHz band high-frequency characteristics. It has excellent filling properties for uneven surfaces at low temperature and low pressure, and it can achieve high adhesion, high heat resistance, and high reliability. It is suitable for application in electronic components for RF modules, which require miniaturization and low profile. 【Features】 ■ Low dielectric constant and low dielectric loss tangent ■ Thin layer insulation: 5–30µm thickness ■ Excellent filling properties for uneven surfaces at low temperature and low pressure ■ Thermosetting resin film ■ Applicable to electronic components for RF modules *For more details, please request documentation or view the PDF data available for download.

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