Adfrema "Insulating Encapsulation Film for Semiconductors"

Thin films and high-insulation adhesive films that respond to the high-frequency, thin, and compact trends of semiconductors and passive components.

The "semiconductor insulating encapsulation film" is a product of Namix, a company engaged in the research, development, manufacturing, and sales of electrochemical materials, under the trademark "Adfrema." It is a pre-supply type film underfill material that is laminated onto a substrate or interposer, followed by thermal compression bonding (TCB) of the chip, and serves as an encapsulation type underfill material. This material is capable of improving productivity and controlling fillet width (compatible with KOZ), and it can also be supplied to wafers. 【Features】 ■ Pre-supply type film ■ Improved productivity ■ Capable of fillet width control ■ Can be supplied to wafers *For more details, please refer to the PDF document or feel free to contact us.

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