Technical documentation on "high heat dissipation of substrates" necessary for product miniaturization.
Handbook on 'Improving Heat Dissipation of PCBs' is now available! High heat dissipation of PCBs is essential for miniaturizing products! Includes advantages and disadvantages of using copper and aluminum.
In the miniaturization of products, enhancing the thermal dissipation of the substrate is essential. Heat sinks are used to improve thermal conductivity, but they take up extra space, which contradicts the goal of miniaturization. Meito Electric specializes in processing that improves the thermal dissipation of substrates by using aluminum and copper as conductors. ★ We have a proven track record in various fields, including automotive substrates and LED substrates! We are currently offering technical materials related to improving substrate thermal dissipation for free! These materials also include the advantages and disadvantages of substrates made from copper and aluminum. *If you would like the technical materials, please feel free to download them or contact us.
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【Technical Data Table of Contents】 - Aluminum Conductor Substrate - Copper Embedded Substrate - Aluminum Core Multi-layer Substrate - Thick Copper Substrate / Thick Copper Multi-layer Substrate - Aluminum Base / Copper Base Substrate - Special Processing Technology - Impedance Measurement *For details, please download from the link below.
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Products created from Meito Electric's technology, which seeks higher precision, contribute to safety and comfort. If you have any questions about printed circuit boards or electrical insulation materials, please feel free to consult us.
![[Information] Various Measures for Heat Dissipation in Circuit Board Design](https://image.mono.ipros.com/public/product/image/d07/2000734510/IPROS86369281067735125639.png?w=280&h=280)
