Semiconductor heat dissipation substrate for the purpose of exothermic and endothermic processes - Base plate [Heat sink]

Adoption of precision total extraction mold! High accuracy in outer shape and hole pitch, improved finish on the burr surface and shear surface!

We handle "base plates" and "heat sinks." Thanks to our precision progressive dies, the accuracy of the outer shape and hole pitch has significantly improved, resulting in enhanced finish quality on both the edge and shear surfaces. With the adoption of progressive dies for coil materials, continuous processing is possible for thicknesses up to 5mm, contributing to lower costs and shorter delivery times. We also utilize UV printing. Additionally, we can accommodate micron-level flatness and specified warp processing, as well as resist baked printing. 【Features】 ■ High accuracy of outer shape and hole pitch due to precision progressive dies ■ Continuous processing of coil materials up to 5mm thickness with the use of progressive dies ■ Adoption of UV printing ■ Capability for micron-level flatness and specified warp processing ■ Support for resist baked printing *For more details, please refer to the PDF document or feel free to contact us.

Processing Contract