A thick copper three-layer substrate with a total thickness of 0.35mm! Suitable for applications such as mobile phone camera flash substrates.
We handle "heat dissipation structure substrates" with built-in copper. We use a thick copper three-layer substrate (inner layer copper thickness 0.2mm, total board thickness 0.35mm) and ultra-thin PP (0.03mm). These are used for applications such as mobile phone camera flash substrates. 【Required Performance】 ■ Circuit and SR alignment tolerance of 0.04mm ■ Surface treatment for gold wire bonding (electroless NiPdAu plating) ■ Deviation tolerance between the outer shape centerline and the component pad centerline of ±0.075mm *For more details, please refer to the PDF document or feel free to contact us.
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basic information
By combining with high-precision machining technology, we can provide high thermal conductivity substrates suitable for high-density mounting modules. As options for heat dissipation technology, we offer various methods such as thick-bodied designs, copper pillar technology, heat dissipation vias, and heat-dissipating resin filling, providing the optimal solution according to your application needs.
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Applications/Examples of results
Various module circuit boards (converter modules, RF modules)
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Company information
Morimar SSP Co., Ltd. is engaged in the development, manufacturing, processing, and sales of various synthetic resins and chemicals, as well as their raw materials. Utilizing the production systems of the Morimar Group both domestically and internationally, we are expanding our global initiatives across a wide range of products, including FRP raw materials and molded products, glass fibers, printed circuit boards, resin raw materials, and functional films, targeting markets both in Japan and abroad.
![[Information] Various Measures for Heat Dissipation in Circuit Board Design](https://image.mono.ipros.com/public/product/image/d07/2000734510/IPROS86369281067735125639.png?w=280&h=280)
![Semiconductor heat dissipation substrate for the purpose of exothermic and endothermic processes - Base plate [Heat sink]](https://image.mono.ipros.com/public/product/image/462/2000445848/IPROS03776884707830630519.jpeg?w=280&h=280)
