Introducing a high thermal conductivity substrate that connects the LED heat dissipation pad and copper base through a copper bump.
The "Original DPGA (for high-brightness, high-heat-dissipation LEDs)" is a high-heat-dissipation substrate that connects the LED's heat dissipation pad to a copper base via copper bumps. Thanks to the high thermal conductivity of copper, it is possible to efficiently release the heat from high-brightness LEDs. The significant difference between aluminum substrates, CEM3 substrates, and DPGA substrates is that they connect directly to the LED heat dissipation pad, allowing for efficient heat dissipation. 【Features】 ■ Efficiently releases heat from high-brightness LEDs ■ High thermal conductivity of copper ■ Enables efficient heat dissipation *For more details, please refer to the PDF materials or feel free to contact us.
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With the diversification and high performance of products, electronics are rapidly advancing towards high performance and high heat dissipation. They are used in various applications such as televisions, computers, and digital cameras, and are not only common products but also widely utilized as core components in medical devices and information communication equipment. In addition to the obvious requirements of QCD (Quality, Cost, Delivery), the importance of environmental pollution countermeasures is increasing, making it urgent to address these issues. To meet the needs of a changing era and as a means to tackle environmental problems, Daiwa Industry Co., Ltd. has developed and patented its unique technology "DPGA (New AGSP)" and is providing this technology to the industry, continuously working towards making it the industry standard. As a first step to address environmental issues, we have achieved energy-saving solutions through high heat dissipation substrates. We offer technologies and products that can accommodate various solutions, including heat dissipation, and can provide a consistent solution from prototype to mass production. We look forward to your continued support for Daiwa Industry's DPGA.
![[Examples of Using Mmems Substrates] High Thermal Dissipation Substrate for High Brightness LEDs](https://image.mono.ipros.com/public/product/image/6b7/2000462778/IPROS66024267372851426525.png?w=280&h=280)
![Semiconductor heat dissipation substrate for the purpose of exothermic and endothermic processes - Base plate [Heat sink]](https://image.mono.ipros.com/public/product/image/462/2000445848/IPROS03776884707830630519.jpeg?w=280&h=280)
