ダイワ工業 Product Lineup

The "High Current Compatible Thick Copper Substrate" is a substrate that consists of a core material bonded with a copper plate as the outer layer. The thickness of the outer layer copper can be up to 400μ. It is designed to accommodate high current applications. Additionally, it can also support multilayer boards where copper plates are bonded to the inner layers, with only the outer layer being thick copper. Thick copper can be used for both outer layer circuits and inner layer circuits. 【Features】 ■ A 4-layer board combining 35μ inner layer with 300μ outer layer ■ Compatible with the step of thick copper through silk printing with inkjet *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Printed Circuit Board

We would like to introduce our "Copper Base/Aluminum Base Substrates." The "Copper Base" is a plain substrate without copper bumps. It features a high thermal conductivity copper material with a 4-10W insulation layer and copper foil laminated together, suitable for high heat dissipation of LEDs. The "Aluminum Base Substrate" is compatible with aluminum substrate materials from various manufacturers. You can choose suitable materials from a wide lineup based on thickness, thermal conductivity, and more. 【Features】 <Copper Base> - No copper bumps - High thermal conductivity copper material with a 4-10W insulation layer and copper foil laminated - Suitable for high heat dissipation of LEDs <Aluminum Base Substrate> - Compatible with aluminum substrate materials from various manufacturers - A wide selection of suitable materials available *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Printed Circuit Board

"DPGA-EF" is a type of substrate that embeds copper pins only in the necessary areas. It can be produced at a lower cost compared to copper bases with bumps. The copper pins are inserted into the holes of the rigid substrate and fixed with resin. Unlike press-fitting, there is no risk of cracks or other issues. Additionally, the copper pins are embedded all at once. Unlike the press-fitting method, the cost difference based on the number of copper pins can be minimized. 【Features】 ■ Both sides of components can be mounted ■ Heat-generating components can be cooled precisely ■ There are no concerns about cracks or chemical residue, as it differs from the copper pin press-fitting method ■ It can be produced at a lower cost compared to copper bases with bumps ■ Unlike the press-fitting method, the cost difference based on the number of copper pins can be minimized *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Printed Circuit Board

The "DPGA-S" is a high thermal conductivity substrate that separates the copper base on the back side and is designed for insulation. Thanks to the high thermal conductivity provided by the through-type copper bumps, it is possible to make the insulation layer up to 0.3mm thick. This allows for maintaining the strength of the substrate even after separating the copper base. Additionally, by separating the layers, it is also possible to mount electrodes on the copper base side. 【Features】 ■ High thermal conductivity due to through-type copper bumps ■ Insulation layer can be made up to 0.3mm thick ■ Allows for mounting electrodes on the copper base side by separating the layers ■ The back side can also be utilized for electrical connections *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Printed Circuit Board

"DPGA-M" is a high thermal conductivity substrate that features a single-sided multilayer design and supports backside wiring. By adopting a single-sided multilayer structure, it significantly enhances design flexibility, allowing for backside wiring. Although it has multiple layers stacked on one side, it is possible to penetrate copper bumps. This enables direct connection of high thermal conductivity components to the copper base and heat sink. 【Features】 ■ Single-sided multilayer structure ■ Enables backside wiring ■ Allows for equal-length wiring even in the presence of parallel circuits ■ Significantly increases design flexibility ■ Enables direct connection of high thermal conductivity components to the copper base and heat sink *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Printed Circuit Board

The "Original DPGA (for high-brightness, high-heat-dissipation LEDs)" is a high-heat-dissipation substrate that connects the LED's heat dissipation pad to a copper base via copper bumps. Thanks to the high thermal conductivity of copper, it is possible to efficiently release the heat from high-brightness LEDs. The significant difference between aluminum substrates, CEM3 substrates, and DPGA substrates is that they connect directly to the LED heat dissipation pad, allowing for efficient heat dissipation. 【Features】 ■ Efficiently releases heat from high-brightness LEDs ■ High thermal conductivity of copper ■ Enables efficient heat dissipation *For more details, please refer to the PDF materials or feel free to contact us.

• Circuit board design and manufacturing
• Printed Circuit Board

Our company was founded in 1967, starting as a metal pressing processing business, and applied that technology to the contour processing of printed circuit boards. We began manufacturing printed circuit boards in 1982 and have continued to this day. We have also succeeded in developing technology that enables general printed circuit boards to have heat dissipation properties equivalent to or exceeding those of ceramics. Focusing on "manufacturing and technology development" that leads the world without being swayed by environmental changes, we provide our customers with excitement and satisfaction. 【Business Activities】 ■ Manufacturing, development, and sales of printed wiring boards *For more details, please refer to the PDF document or feel free to contact us.

• Wiring materials
• Contract manufacturing
• Circuit board design and manufacturing

We would like to introduce Daiwa Kogyo Co., Ltd.'s "High Heat Dissipation and High Current Circuit Boards." Our "High Heat Dissipation Circuit Board" replaces ceramic substrates, achieving cost reduction in substrate expenses. Additionally, by switching from water cooling to air cooling, we achieve cost reduction in unit expenses. We also manufacture products such as "Copper Pin Embedded Circuit Boards," which reduce thermal damage to components, as well as "Aluminum Base/Copper Base Circuit Boards" that can handle thermal conductivity up to 10W, and "Thick Copper Circuit Boards" suitable for high current. If you are having trouble with circuit boards, please feel free to consult with us. 【Features】 ■ High Heat Dissipation Circuit Board - Achieves cost reduction in substrate expenses by replacing ceramic substrates - Achieves cost reduction in unit expenses by switching from water cooling to air cooling - Realizes reduction in unit size and component costs through miniaturization of heat sinks/fans ■ Copper Pin Embedded Circuit Board - Provides pinpoint heat dissipation from high-heat components - Reduces thermal damage to components *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Circuit board design and manufacturing

"DPGA" stands for "Daiwa Process Global Advance," which is a process developed independently by Daiwa Industrial that uses metal Cu bumps for interlayer wiring connections. A substrate with high heat dissipation characteristics enables high brightness and long lifespan of LEDs, as well as miniaturization of heat sinks. 【Features】 ○ Interlayer connection using metal pillars (copper bumps) → Achieves low resistance, high connection reliability, and high thermal conductivity ○ Copper bumps can be of any shape and size → For cylindrical shapes, diameters can range from 0.3 to 4.00 mm ○ Mixing of copper bumps of different sizes is possible ○ Improved thinness, lightness, and rigidity → Minimum board thickness: 0.3 mm, using prepreg for the insulation layer ○ Maximizes the functionality of LEDs → Ideal for LED substrates (liquid crystal panels, lighting) and automotive substrates For more details, please contact us or download the catalog.

• Printed Circuit Board