Achieving unit cost reduction, unit size reduction, and extended lifespan. Ideal for LED substrates and automotive substrates!
We would like to introduce Daiwa Kogyo Co., Ltd.'s "High Heat Dissipation and High Current Circuit Boards." Our "High Heat Dissipation Circuit Board" replaces ceramic substrates, achieving cost reduction in substrate expenses. Additionally, by switching from water cooling to air cooling, we achieve cost reduction in unit expenses. We also manufacture products such as "Copper Pin Embedded Circuit Boards," which reduce thermal damage to components, as well as "Aluminum Base/Copper Base Circuit Boards" that can handle thermal conductivity up to 10W, and "Thick Copper Circuit Boards" suitable for high current. If you are having trouble with circuit boards, please feel free to consult with us. 【Features】 ■ High Heat Dissipation Circuit Board - Achieves cost reduction in substrate expenses by replacing ceramic substrates - Achieves cost reduction in unit expenses by switching from water cooling to air cooling - Realizes reduction in unit size and component costs through miniaturization of heat sinks/fans ■ Copper Pin Embedded Circuit Board - Provides pinpoint heat dissipation from high-heat components - Reduces thermal damage to components *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 ■ Aluminum base / Copper base substrate - Supports thermal conductivity up to 10W - Compatible with various materials / insulation layers ■ Thick copper substrate for high current - Outer layer 350μ / Inner layer 35μ - Outer layer 70μ / Inner layer 250μ ■ General substrate - Multi-layer substrates with tracking resistance (CTI value 600) can be manufactured - Supports from small prototype quantities to medium lot mass production - Produces a large number of substrates required for long-term reliability in industrial equipment, automotive, and medical devices ■ Has numerous partner companies, covering everything from design to substrate and component mounting in a one-stop solution ■ Reproduction from film / raw substrates is also possible through scanning *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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With the diversification and high performance of products, electronics are rapidly advancing towards high performance and high heat dissipation. They are used in various applications such as televisions, computers, and digital cameras, and are not only common products but also widely utilized as core components in medical devices and information communication equipment. In addition to the obvious requirements of QCD (Quality, Cost, Delivery), the importance of environmental pollution countermeasures is increasing, making it urgent to address these issues. To meet the needs of a changing era and as a means to tackle environmental problems, Daiwa Industry Co., Ltd. has developed and patented its unique technology "DPGA (New AGSP)" and is providing this technology to the industry, continuously working towards making it the industry standard. As a first step to address environmental issues, we have achieved energy-saving solutions through high heat dissipation substrates. We offer technologies and products that can accommodate various solutions, including heat dissipation, and can provide a consistent solution from prototype to mass production. We look forward to your continued support for Daiwa Industry's DPGA.
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