Introducing a case study on the introduction of high-multilayer rigid substrates by Murakami Electronics Co., Ltd.!
Murakami Electronics Co., Ltd. is a manufacturer specializing in the prototyping and mass production of double-sided and multilayer printed circuit boards. We would like to introduce a case study of the "High Multilayer Rigid Board" using FR-5 material. 【Case Study】 ■ High Multilayer Rigid Board ・0.5mm Pitch BGA ・0.5mm Pitch Through-hole TH Type PWB (Surface Pad on Via) *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications】 ■Material: FR-5 ■Board thickness: 4.8t ■Number of layers: 40-layer class ■Drill diameter: φ0.2mm ■Land diameter: φ0.4mm ■Pad: φ0.4mm ■Circuit width: 0.07mm ■Inner layer clearance: 115μm *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Our company is a manufacturer of prototypes and mass production of multilayer boards from double-sided boards. We manufacture "printed circuit boards," which can be said to be involved in almost everything related to electricity. Since we have a consistent production process in one factory, we can accommodate the manufacturing of various types of boards. We have a production line that can handle everything from prototypes to mass-produced items, so we can provide the necessary production volume at the required timing based on your consultation. Additionally, we respond to circuit development, implementation, and assembly related to printed circuit boards under the motto of TOTAL BEST. Please feel free to contact us for any inquiries.
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