Introducing a case study on the introduction of rigid substrates by Murakami Electronics Co., Ltd.!
Murakami Electronics Co., Ltd. is a manufacturer specializing in the prototyping and mass production of double-sided and multilayer printed circuit boards. We will introduce examples of rigid boards, including the "6-layer through-hole board," "10-layer through resin-filled board," and "single-layer build-up board." 【Case Studies】 ■6-layer through-hole board ・Thickness: 1.6 mm, Electroless gold *For more details, please refer to the PDF document or feel free to contact us.
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【Other Case Studies】 ■10-Layer Through-Resin Embedded Substrate ・Board Thickness: 1.2mm, 0.5mm ・Pitch BGA (Scale: 0.05mm* for reference) ■Single-Layer Build-Up Substrate (Laser Via) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company is a manufacturer of prototypes and mass production of multilayer boards from double-sided boards. We manufacture "printed circuit boards," which can be said to be involved in almost everything related to electricity. Since we have a consistent production process in one factory, we can accommodate the manufacturing of various types of boards. We have a production line that can handle everything from prototypes to mass-produced items, so we can provide the necessary production volume at the required timing based on your consultation. Additionally, we respond to circuit development, implementation, and assembly related to printed circuit boards under the motto of TOTAL BEST. Please feel free to contact us for any inquiries.
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