Plating device "Plating Basic"

Pursuing ease of use and compactness! Adopting a constant current control circuit eliminates the need for current density adjustment!

The "Mekki Basic" is a plating device that improves workability by adopting a constant current control circuit, eliminating the need for cumbersome current density adjustments. It maintains the plating solution at an appropriate temperature using a heater installed in the plating tank. The temperature can be selected from 45°C and 55°C, allowing for flexible operation tailored to the plating solution. We also offer a compact plating device called "Chibi Mekki," which is specifically designed for plating a single ring with simple operation. 【Features】 ■ Adoption of constant current control circuit ■ No need for current density adjustments ■ Maintains plating solution at an appropriate temperature with a heater installed in the plating tank ■ Selectable between 45°C and 55°C *For more details, please refer to the PDF document or feel free to contact us.

Plating Equipment