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  6. Hybrid I.C [Achieving optimal circuit configuration and external structure!]

Hybrid I.C [Achieving optimal circuit configuration and external structure!]

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last updated:Oct 02, 2017

光山電気工業 拡販推進
光山電気工業 拡販推進
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Custom-designed ICs that achieve optimal circuit configuration and external structure! Contributing to the miniaturization of your products!

The "Hybrid I.C (H.I.C)" is a custom-designed IC that achieves the optimal circuit configuration and external structure according to customer requirements. Our company supports various substrates, including ceramic substrates, glass epoxy boards, and flexible boards. We contribute to the miniaturization of our customers' products through a wide range of mounting technologies, such as thick film printing and bare chip mounting. Furthermore, we provide production support with our long-established manufacturing quality, from ultra-small substrates to high-density assembly boards. 【Features】 ■ Custom specifications available ■ Contributes to miniaturization ■ Supports a wide range of mounting technologies *For more details, please request materials or view the PDF data available for download.

    Other electronic partsASICDedicated IC
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Hybrid I.C [Achieving optimal circuit configuration and external structure!]

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【Hybrid IC Implementation Technology】 ■ Ceramic Substrate - Capable of mixed analog and digital circuits, with functional trimming possible - Most circuits can be converted to hybrid ICs ■ Flexible Substrate - Allows for high-density mounting with bare chips - Bendable substrate offers high freedom in shape, enabling large substrates ■ Glass Epoxy Substrate - Allows for high-density mounting with bare chips - High freedom in shape, enabling large substrates ■ Aluminum Substrate - Excellent heat dissipation and shielding properties - Supports high-reliability hybrid ICs for electrical applications *For more details, please refer to the PDF document or feel free to contact us.

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光山電気工業

光山電気工業 拡販推進

Industrial Electrical Equipment

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Kōzan Electric Industry Co., Ltd. primarily focuses on the production of hybrid integrated circuits (H.I.C) and handles products such as clock modules, PDP driver modules, automotive igniters, and SAW modules for mobile phones. Additionally, we produce transmission communication equipment components suitable for the IT era, such as optical INF and optical-related modules, and supply highly reliable products like railway signaling equipment and unit assembly wiring. Please feel free to contact us if you have any inquiries.

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