A cleaning machine that achieves a significant increase in processing power with simultaneous slurry injection!
The "Carbon Dioxide Dry Station" is a cleaning machine that provides optimal performance by selecting the nozzle size according to the cleaning purpose and substrate material. By changing the nozzle size, it enables variable CO2 particle size, variable CO2 density, and variable CO2 ejection speed. Additionally, by adopting an N2 purge nozzle, it can reduce the processing time to less than 1/6. 【Features】 ■ Significant increase in processing power with simultaneous slurry injection ■ Prevention of electrostatic discharge through simultaneous injection of various liquid inert gases *For more details, please download the PDF or feel free to contact us.
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【Cleaning Applications】 ■ Lift-off and deburring after etching for GaAs, Fe-RAM, GMR heads, etc. ■ Metal types: High-grade precious metals such as Pt, Ir, and multilayer films like NiFe, Cr. ■ Removal of organic and metal particles on ITO for organic and inorganic EL (before EL element film formation). ■ Removal of dark spots, etc. *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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At Femtech Co., Ltd., we mainly handle polishing technology equipment and cleaning/ice screen technology and equipment. By integrating polishing technology and ultra-precision cleaning technology with our extensive proprietary technological assets and the latest elemental technologies, we provide various equipment and materials to the semiconductor and electronic device industries. Please feel free to contact us if you have any inquiries.