Comparison of foreign matter removal rates between steam two-fluid cleaning and ultrasonic/high-pressure cleaning is now available.

Currently publishing a comparison of removal rates between steam two-fluid cleaning using supersonic jets of steam and liquid, and ultrasonic/high-pressure cleaning (OLED).

The steam two-fluid cleaning unit "SSC series" injects steam and liquid fluids at supersonic speeds from a supersonic injection nozzle, generating micro-cavitation on the surface of the target object for cleaning. By mixing liquid with steam, a two-fluid system is created, significantly enhancing the cleaning power. To suppress metal contamination and the generation of fine foreign substances, a special coating is applied to the surface using specific materials, producing high-purity steam. On this page, we are publishing graph data comparing the foreign substance removal rates of our products with ultrasonic + high-pressure cleaning, specifically targeting organic EL. 【Features】 ■ No consumables like brushes, significantly reducing running costs ■ Only "pure water" is used ■ Significantly reduces the amount of chemical agents used ■ Greatly improves cleaning power ■ Also suitable for semiconductor cleaning *For more details, please request documentation or view the PDF data available for download.

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