Ideal for fine pitch printing! Suppresses slumping and solder balls during rapid heating.
"VAPY-F LF219" is a highly versatile lead-free solder paste that supports fine pitch applications with high insulation reliability. It excels in printing fine pitch patterns, such as 350μm pitch QFPs and chip components smaller than 0603. Additionally, it suppresses slumping and solder balls that are likely to occur during rapid heating, which is common with fine powder type pastes. Despite being a fine powder and containing halogens, it boasts high insulation reliability. 【Features】 ■ Highly versatile ■ Lead-free ■ Excellent for fine pitch pattern printing ■ Suppresses slumping and solder balls during rapid heating ■ High insulation reliability despite being a fine powder and containing halogens *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 ■ Good shape stability during printing even with fine pitch patterns ■ Excellent wettability ■ Good wettability despite using Type 5 powder ■ Suppression of solder ball formation even when capacitors are mounted *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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With the policy of being "earth-friendly," we provide flux cleaning agents that replace halogen-based organic solvents, various cleaning agents for processed parts, and a no-clean type flux using new modified rosin.