Significant cost reduction by switching from glass-based to paper phenol! Completely halogen-free.
The "XFP LF138" is a low-melting point, halogen-free, lead-free solder paste that achieves significant cost reduction by switching from glass-based to paper phenol. It eliminates hand insertion and dipping, allowing for bulk reflow. This greatly streamlines the process, contributing to energy savings and CO2 reduction. 【Features】 ■ Completely halogen-free ■ Lead-free ■ Significant cost reduction ■ Eliminates dipping for bulk reflow ■ Major process streamlining *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Other Features】 ■ Energy saving and CO2 reduction ■ Excellent printability ■ Maintains excellent transferability even in high-speed printing ■ Compatible with atmospheric reflow ■ Exhibits performance equivalent to SAC305 products *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
With the policy of being "earth-friendly," we provide flux cleaning agents that replace halogen-based organic solvents, various cleaning agents for processed parts, and a no-clean type flux using new modified rosin.