High resolution, low resolution, and various inspections! Options for single-sided/double-sided and color/monochrome available!
The "AFV-1 device for semiconductor package substrates" is a device capable of high-resolution, low-resolution, and various inspections. By utilizing CAM, it generates Auto References. In addition to single-sided/double-sided inspections, you can choose between color and monochrome. 【Features】 ■ Capable of inspecting high-resolution, low-resolution, and various products ■ Monochrome and color inspections available ■ Double-sided and single-sided inspections available ■ Generates Auto References using CAM *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications】 ■ Input/Output Type: Stack (NSOP) ■ Camera: 18K Mono TDI Line Scan / 25M Color Area Scan ■ Line Scan ・Resolution: 2–5.5um/pixel ・FOV: 35–98mm ■ Area Scan ・Resolution: 5.5um/pixel ・FOV: 27.8×27.8mm ■ Surface Treatment: Various SR options available besides Au-Ni, OSP, ENIG, ENEPIG ■ Alignment Method: Fiducial Mark, using patterns under SR ■ Dimension (mm): W2406×L1918×H1824 *For more details, please refer to the PDF document or feel free to contact us.
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Rat Corporation aims to be a company that satisfies its customers by leveraging its network with various electronic-related businesses both domestically and internationally to provide higher-level products and meet the diverse needs of its clients. For materials, equipment, manufacturing, and design of photomasks and printed circuit boards, trust Rat Corporation.