Automatic device for reducing warpage of thin wafers after back grinding, capable of outer circumference cutting after tape application.
The "Full Auto BG Tape Laminator" is an automatic device that allows for peripheral cutting after applying tape for back grinding, aimed at surface protection. By adopting a unique roller structure for the application, it has achieved tape application with almost no tension. It is effective in reducing warpage of thin wafers after back grinding. 【Features】 ■ Peripheral cutting possible while controlling tension ■ Reduces warpage of thin wafers after back grinding ■ Low tension application ■ High precision peripheral cutting ■ Compatible with high bump tape *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 ■ Compatible with 300mm/200mm wafers ■ Electrostatic measures ■ SECS communication compatible (optional) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Omiya Industrial Co., Ltd. manufactures and sells precision measuring instruments, semiconductor and liquid crystal manufacturing-related equipment, and provides maintenance for rotating machinery. Please feel free to contact us if you have any inquiries.
