Simultaneous dicing with two spindles facing each other! A high-performance device that doubles productivity!
The "7900 Duo" is a dicing saw equipped with two opposing spindles that simultaneously dice wafers, doubling productivity. The dicing saw is fixed to the front-mounted spindle, eliminating the effects of heat and preventing misalignment of the cut position, which ultimately increases yield. Additionally, by combining a small footprint with high productivity and automation, it reduces costs, leading to a decrease in ownership costs and, consequently, a reduction in cost per product. 【Features】 ■ Simultaneous dicing with two opposing spindles ■ Low vibration base ■ Improved productivity with quick automatic alignment and cut positioning ■ Reduced ownership costs with a small footprint *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 ■ Improved yield through automatic wafer inspection ■ Maximum accuracy guaranteed with automatic Y-axis correction ■ Consistent cut quality ensured through tape surface inspection ■ Touchscreen user interface ■ Options ・Damaged wafer recognition, tape surface detection, advanced multi-magnification imaging equipment ・Powerful spindle for rigid and thick applications, special chuck, dress station *For more details, please refer to the PDF document or feel free to contact us.
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【Applications】 ■LEDs, image sensors, discrete devices, RFID, solder devices ■MEMS and other products that require long cutting times, etc. *For more details, please refer to the PDF document or feel free to contact us.
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