Automatic Dicing Device "7900 Duo"

Simultaneous dicing with two spindles facing each other! A high-performance device that doubles productivity!

The "7900 Duo" is a dicing saw equipped with two opposing spindles that simultaneously dice wafers, doubling productivity. The dicing saw is fixed to the front-mounted spindle, eliminating the effects of heat and preventing misalignment of the cut position, which ultimately increases yield. Additionally, by combining a small footprint with high productivity and automation, it reduces costs, leading to a decrease in ownership costs and, consequently, a reduction in cost per product. 【Features】 ■ Simultaneous dicing with two opposing spindles ■ Low vibration base ■ Improved productivity with quick automatic alignment and cut positioning ■ Reduced ownership costs with a small footprint *For more details, please refer to the PDF document or feel free to contact us.

Plastic processing machines (cutting and rolling)Other processing machinesWafer processing/polishing equipment