Optimize dicing time! A single spindle that contributes to yield improvement and cost reduction!
The "7900 Uno" is an automatic, single-spindle dicing device. The "model 7910" consists of a 2" spindle and an 8" size. It features an easy-to-use, intuitive, GUI-based touch screen. It has a small installation footprint, is compact, and easy to maintain. In addition to performing cutting surface inspection, quality analysis, process data collection, and statistical analysis, it also has compatibility technology with the 7900 dual spindle device. 【Features】 ■ Low ownership costs ■ Small installation footprint and compact ■ High reliability and high precision ■ Optimization of dicing time ■ Yield improvement and cost reduction functions *For more details, please refer to the PDF materials or feel free to contact us.
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【Optical Performance】 ■ Advanced continuous image magnification function ■ Broken blade detection device ■ Built-in polishing machine ■ Various porous ceramic chucks (4", 5", 6", or 8") ■ High-power spindle ■ Barcode reader ■ Dicing floor management system (DFM) *For more details, please refer to the PDF document or feel free to contact us.
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【Main Uses】 ■ LED packages and wafers ■ Discrete device wafers ■ Power device wafers ■ Glass wafers 【Main Users】 ■ Universities, research institutes ■ IC back-end processes (2" to 8" wafer dicing production lines) ■ Initial LED operations such as process development, pilot production, R&D, etc. ■ MEC - Micro electronic components *For more details, please refer to the PDF materials or feel free to contact us.
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![[Data] 7120/7130 Expansion Automatic Dicing Machine](https://image.mono.ipros.com/public/product/image/7c7/2000350860/IPROS7518895817979121024.jpg?w=280&h=280)
![[Research Material] Global Market for Thin Wafer Processing and Dicing Equipment](https://image.mono.ipros.com/public/product/image/6e6/2001468183/IPROS80839736394132712623.jpeg?w=280&h=280)
