Highly adaptable to soft and hard materials! A long-lasting dicing blade based on metal.
The "Metal Sintered Dicing Blade" is a dicing blade composed of abrasives embedded in a metal substrate. Through a unique closed mold sintering process, the particle size of the diamond, the density of the diamond, and the metal binder are optimized to meet specific application precision and blade lifespan according to needs. The metal binder provides an extremely stable, stress-free substrate, and can be customized to meet the hardness and load resistance required for various dicing applications. 【Features】 ■ Various substrates for a wide range of applications ■ Low wear and long blade lifespan ■ High precision in blade dimensions ■ High precision in dicing ■ Attractive ownership cost *For more details, please refer to the PDF materials or feel free to contact us.
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【Application Examples】 ■ PBGA (FR4 and resin): 40μm, 45μm, 50μm, 55μm ■ Magnetic heads (TiC): 3–6μm, 10μm, 17μm ■ Optical sensor communication (glass): 15μm, 17μm, 20μm, 25μm, 30μm, 45μm ■ LTCC (soft alumina): 20μm, 25μm, 30μm, 35μm ■ QFN (copper + epoxy molding): 70μm, 80μm *For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■ For soft materials such as PCBs, silicon, and BGAs, as well as substrates. *For more details, please refer to the PDF document or feel free to contact us.
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