A soft material and a hard material that undergoes machining! A long-lasting blade with excellent wear resistance.
The "Nickel Bond Blade" is a dicing blade composed of an abrasive embedded in a nickel bond substrate. It is manufactured using an artistically controlled electronic forming process, ensuring that diamonds are uniformly distributed throughout the nickel layer. This process not only allows the blade to be manufactured with extremely tight tolerances but also enables customization to meet specific customer requirements regarding particle size, hardness, and distribution. 【Features】 ■ Excellent wear resistance with a hard binder ■ Extremely thin blades (down to .0008”) ■ Outstanding durability against high exposure ■ Highly precise dicing ■ Exceptional blade longevity *For more details, please refer to the PDF document or feel free to contact us.
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【Application Examples】 ■ PCB/LED Packages (FR4 and BT Resin): 10μm, 13μm, 17μm ■ BGA (FR4 and Epoxy Mold): 30μm, 50μm ■ Multi-layer Capacitors (Green Ceramic): 30μm, 50μm ■ Ultrasonic Sensors/Micro Positioners (PZT): 6–8μm, 10μm ■ Tape Heads (Ferrite): 3–6μm, 10μm, 13μm ■ Magnetic Heads (TIC): 3–6μm, 10μm, 13μm *For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■ For soft materials such as PCBs, silicon, and BGAs, as well as substrates. *For more details, please refer to the PDF document or feel free to contact us.
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