Constantly exposing diamonds through self-grinding! Excellent cutting ability to handle hard and brittle materials.
The "Resin Bond Blade" is a dicing blade composed of abrasives embedded in a resin bond base. The blade's edge continuously exposes new diamonds, and the speed is controlled to keep the edge sharp, achieving highly accurate cuts with remarkable yield and long blade life. It is suitable for hard and brittle materials such as alumina, glass, and quartz. 【Features】 ■ Self-sharpening base that exposes diamonds ■ Excellent cutting performance ■ Base suitable for hard, durable, and complex materials ■ Highly precise dicing ■ Attractive ownership cost *For more details, please refer to the PDF document or feel free to contact us.
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【Application Examples】 ■ QFN (Copper + Epoxy Mold): 45μm, 53μm, 63μm, 75μm, 88μm, 105μm ■ Hybrid Substrate and Ceramic Package (Alumina): 30μm, 45μm, 53μm, 63μm, 88μm ■ Solder Devices (LiTaO3 & LiNbO3): 15μm, 20μm, 30μm ■ Solder Devices (Quartz): 25μm, 30μm, 35μm, 45μm ■ Tape Head (Ferrite): 6μm, 9μm ■ Communication (Glass + Silicon): 20μm, 25μm, 30μm ■ Optical Devices (Glass): 3μm, 6μm, 9μm ■ Fiber Optics (Glass): 25μm, 30μm, 35μm, 45μm ■ Optical Splitter (Quartz): 25μm, 30μm, 35μm, 45μm *For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■ For hard and fragile materials such as alumina, glass, and quartz *For more details, please refer to the PDF document or feel free to contact us.
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