Improving heat dissipation across the entire substrate! The "aluminum core substrate" is lighter than the copper core substrate.
For high current substrate applications! The "aluminum core substrate," lighter than copper core substrates, also improves overall heat dissipation.
"Aluminum core substrate" is a suitable substrate when you want to improve heat dissipation throughout the substrate while also reducing weight compared to copper core substrates. 【Features】 ● Excellent thermal conductivity ● Industry's highest dielectric breakdown voltage ● Lower dielectric constant compared to epoxy resin substrates *For more details, please refer to the PDF materials or contact us directly.
Inquire About This Product
basic information
【Features】 ○ Excellent thermal conductivity ○ Industry's highest breakdown voltage ○ Lower dielectric constant compared to epoxy resin substrates *For more details, please refer to the PDF document or contact us directly.
Price information
Please feel free to contact us.
Delivery Time
※Please feel free to contact us.
Applications/Examples of results
【Applications】 ○ High-brightness LED mounting boards ○ Automotive boards ○ Boards requiring high heat dissipation characteristics ○ Various inverter boards ○ Various motor driver boards ○ High-frequency boards *For more details, please refer to the PDF document or contact us directly.
Company information
Products created from Meito Electric's technology, which seeks higher precision, contribute to safety and comfort. If you have any questions about printed circuit boards or electrical insulation materials, please feel free to consult us.
![Semiconductor heat dissipation substrate for the purpose of heat release and absorption [heat sink]](https://image.mono.ipros.com/public/product/image/403/2000449777/IPROS59561808384274111961.jpeg?w=280&h=280)
