A board that connects the metal core and the normal substrate ground through through-hole plating. It achieves both improved heat dissipation characteristics and EMI countermeasures that were not present in conventional designs.
Our company handles "thick copper and special substrates." One of our recommended products is the metal substrate (outer type). 【Features】 This substrate dissipates heat from heated components through the metal by bonding metal to the substrate. ■ Metal core substrate - The metal core part is bonded to the substrate with TH plating. - Compatible with many metals such as aluminum and copper. - Effective for improving thermal conductivity, high-frequency response, and EMI countermeasures. *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
In general metal core substrates, the through-hole connections between the internal metal plate and the copper plating of the substrate part are mostly not supported. This is due to the potential contamination of the plating bath. However, our company has overcome this issue and made it possible to connect the through-hole sections with copper plating using metal materials other than copper, such as aluminum and brass.
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Applications/Examples of results
LED lighting, especially in cases where high current is applied, requires advanced heat dissipation. Utilization in areas where high heat dissipation is required at the final stage amplifier level with millimeter-wave high frequencies.
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Company information
Morimar SSP Co., Ltd. is engaged in the development, manufacturing, processing, and sales of various synthetic resins and chemicals, as well as their raw materials. Utilizing the production systems of the Morimar Group both domestically and internationally, we are expanding our global initiatives across a wide range of products, including FRP raw materials and molded products, glass fibers, printed circuit boards, resin raw materials, and functional films, targeting markets both in Japan and abroad.
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