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  5. Printed Circuit Board
  6. Printed circuit board, metal substrate

Printed circuit board, metal substrate

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last updated:May 09, 2013

TSS
TSS
  • Official site

Metal core substrate with excellent heat dissipation and heat resistance.

By machining the substrate to expose the metal core and directly mounting heat dissipation components such as heat sinks, it is possible to efficiently release the heat from components that operate at high temperatures to the outside.

    Printed Circuit Board
TSS株式会社/アルミヒートシンク基板.jpg

Printed circuit board, metal substrate

TSS株式会社/アルミヒートシンク基板.jpg
TSS株式会社/アルミヒートシンク基板.jpg
  • Related Link - http://www.tssg.com/company/index.html

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basic information

【Features】 ○ A printed circuit board with enhanced heat dissipation and heat resistance. ○ There are two types: a metal base substrate with circuits formed on a metal plate, and a metal core substrate with a metal plate sandwiched inside the substrate. ○ Metal materials can be selected from aluminum, copper, and others. ● For more details, please refer to the catalog or contact us.

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Applications/Examples of results

【Applications】 ○ As a printed circuit board for heat dissipation measures for LED traffic lights and outdoor displays ○ Extracting performance beyond the rated current of high-brightness LEDs and power devices ○ Reliability measures for electronic components due to heat ○ EMI measures utilizing the shielding properties of metals ○ Alternative to ceramic substrates focusing on cost and impact resistance ○ Electronic control in high-temperature environments in conjunction with cooling units ○ Heat dissipation measures for power devices with high heat generation, such as IGBTs and power MOSFETs; reliability measures for electronic components due to heat ○ Reduction of assembly costs and space-saving through integrated busbars (copper core substrate) ○ Low capacitance and large current electromagnetic field control using microstrip structures (copper core substrate)

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Metal substrate

Metal substrate

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TSS

TSS

Electronic Components and Semiconductors

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TSS Corporation has been pursuing heat management substrate technology for over twenty years, counting from its predecessor company. Furthermore, we have incorporated element technologies such as product development technology, thermal design, and evaluation technology to create a unique business model. We have achieved remarkable results, particularly in the growing fields of LED-related and power electronics-related sectors. TSS aims to be the top brand in heat management substrates through our unique technology, and we aspire to continue growing together with our customers while contributing to the growth of the electronics industry in our country.

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