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  5. Printed Circuit Board
  6. Special Printed Circuit Board "High Current Board"

Special Printed Circuit Board "High Current Board"

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last updated:Nov 07, 2017

TSS
TSS
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It is possible to handle large currents on the printed circuit board due to the thick copper pattern!

The "Thick Copper Substrate" enables the realization of circuits with copper thicknesses up to 2000μm, making it possible to handle large currents. It is highly effective for miniaturizing devices with high loads. Additionally, due to its excellent thermal characteristics, it can also be used as a substrate that has a GND function while excelling in thermal diffusion. Furthermore, by stacking the conventional external bus bar as an inner layer circuit, EMI control becomes easier, reducing noise interference with peripheral devices. It frees you from three-dimensional wiring, reduces bus bar processing costs and assembly costs, and achieves space-saving. 【Features】 ■ Enables handling of large currents on printed circuit boards with thick copper patterns ■ Achieves a circuit thickness of 2000μm ■ Ideal for mounting power devices ■ Patent obtained *For more details, please refer to the PDF document or feel free to contact us.

    Printed Circuit Boardothers
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Special Printed Circuit Board "High Current Board"

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  • Related Link - http://tssg.com/products/pwb/daidenryu/

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【Applications and Delivery Performance】 ■ Automotive-related - Busbar substrate for electric vehicle capacitor power supply - Busbar substrate for fuel cell systems ■ Industrial equipment-related - Aluminum heat dissipation power substrate for power supply - Busbar substrate for large control equipment ■ Lighting-related - Control substrate for outdoor large LED displays ■ Consumer products-related - Power FET substrate for electric remote control cars *For more details, please refer to the PDF document or feel free to contact us.

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Special Printed Circuit Board "High Current Board"

Special Printed Circuit Board "High Current Board"

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TSS

TSS

Electronic Components and Semiconductors

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TSS Corporation has been pursuing heat management substrate technology for over twenty years, counting from its predecessor company. Furthermore, we have incorporated element technologies such as product development technology, thermal design, and evaluation technology to create a unique business model. We have achieved remarkable results, particularly in the growing fields of LED-related and power electronics-related sectors. TSS aims to be the top brand in heat management substrates through our unique technology, and we aspire to continue growing together with our customers while contributing to the growth of the electronics industry in our country.

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