Special Printed Circuit Board "Aluminum Heat Sink Substrate"

High heat dissipation aluminum heat sink substrate with an integrated structure of aluminum base substrate and heat sink.

The "Aluminum Heat Sink Substrate" is a substrate that layers a high thermal conductivity insulating layer and circuits onto extruded aluminum heat sink material. It features surface roughening effects and weather resistance due to anodizing treatment, securing more than five times the surface area compared to conventional products. By combining with high thermal conductivity resin, it offers heat dissipation specifications that far exceed those of conventional products. There is absolutely no thermal transport loss, unlike retrofitted heat sinks. It also enables cost reduction in assembly due to its integrated structure, leading to a decrease in total costs. 【Features】 ■ Significantly improved heat dissipation characteristics ■ No thermal transport loss ■ Increased design flexibility for fins ■ Increased design flexibility for enclosures ■ Reduction in assembly costs ■ No need for material procurement *For more details, please refer to the PDF document or feel free to contact us.

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