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  3. Electronic Components and Modules
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  5. Printed Circuit Board
  6. Substrate "High Current Substrate (Thick Copper Circuit Substrate)"

Substrate "High Current Substrate (Thick Copper Circuit Substrate)"

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last updated:May 17, 2017

TSS
TSS
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A high-current board that can minimize current loss compared to the design value!

The substrate is a high-current board that allows for the selection of circuit formation methods based on conductor thickness. If the conductor thickness is 300μm or more, half-etching can be accommodated. This method can reduce the top and bottom widths of the pattern compared to conventional etching methods, minimizing current loss relative to design values. 【Features】 ■ Selection of circuit formation methods based on conductor thickness ■ Half-etching can be accommodated with a conductor thickness of 300μm or more ■ Ability to reduce the top and bottom widths of the pattern ■ Minimal current loss relative to design values *For more details, please refer to the catalog or feel free to contact us.

    Printed Circuit Board
基板『大電流基板(厚銅回路基板)』.JPG

Substrate "High Current Substrate (Thick Copper Circuit Substrate)"

基板『大電流基板(厚銅回路基板)』.JPG
基板『大電流基板(厚銅回路基板)』.JPG
  • Related Link - http://tssg.com/products/pwb/daidenryu/

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【Manufacturable Specifications】 Available Copper Thickness ■ Electrolytic Copper: 105μm, 140μm, 175μm, 210μm ■ Rolled Copper: 300μm to 3,000μm ■ Copper Model Number: C1100 or C1020 ■ Multilayer: Possible ■ Substrate Thickness: Up to 5mm (for thicknesses over 5mm, please consult separately) *For more details, please refer to the catalog or feel free to contact us.

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【Applications】 ■ Battery management (onboard, power converters) ■ EV chargers ■ Industrial inverters ■ Energy storage systems ■ Wind power converters, etc. *For more details, please refer to the catalog or feel free to contact us.

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Substrate "High Current Substrate (Thick Copper Circuit Substrate)"

Substrate "High Current Substrate (Thick Copper Circuit Substrate)"

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TSS

TSS

Electronic Components and Semiconductors

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TSS Corporation has been pursuing heat management substrate technology for over twenty years, counting from its predecessor company. Furthermore, we have incorporated element technologies such as product development technology, thermal design, and evaluation technology to create a unique business model. We have achieved remarkable results, particularly in the growing fields of LED-related and power electronics-related sectors. TSS aims to be the top brand in heat management substrates through our unique technology, and we aspire to continue growing together with our customers while contributing to the growth of the electronics industry in our country.

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