Evaluation of organic pollution's qualitative, quantitative, and distribution aspects using a combination of multiple methods.
In the manufacturing process of semiconductor devices, various adhesive sheets, such as dicing tape, are used. Adhesive sheets can be a source of foreign substances and contamination. Therefore, in this case study, we will present the results of a comprehensive evaluation using TOF-SIMS and SWA-GC/MS. With TOF-SIMS, by conducting qualitative analysis of each adhesive sheet material, it is possible to identify which adhesive sheet is responsible for foreign substances and contamination, as well as which layer of the adhesive sheet is the source. Additionally, SWA-GC/MS allows for quantitative confirmation of which adhesive sheet has the least contamination.
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Analysis of LSI, memory, and power devices.
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Download All Catalogs![[Analysis Case] Analysis of Wafer Adhesive Sheet Components_C0501](https://image.mono.ipros.com/public/catalog/image/01/585/401698/IPROS847523147551117520.jpg?w=120&h=170)
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MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!
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