High-frequency large current is applied to the rotating part, with examples of non-use of mercury type or slip rings.
At Hisawa Giken, which specializes in the design and development of electrical connection mechanisms, we are developing "special specification rotary connectors" that meet various demands. If there are projects that other companies have said are "impossible!" or "difficult!", please feel free to consult with us! Currently, we are distributing materials that introduce our development examples using diagrams and photos. Please download and take a look. [Contents Included] ■ Connectors that allow "high frequency" and "high current" to pass through the rotating part (Manufacturer of semiconductor manufacturing equipment) ■ Connectors that allow "multi-pole" high current to pass through the rotating part (Manufacturer of automotive production equipment) ■ Rotating connectors that allow current to flow to "heater rolls" (Manufacturer of packaging equipment) ■ Mercury-free & slip ring-free rotating connectors for plating equipment (Major connector manufacturer)
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In addition, we also briefly introduce our development and manufacturing achievements in connectors and rotary connectors. For plating attachment, waterproof specifications, high-temperature specifications, high-current specifications, signal lines, industrial machinery, space-saving, high voltage, ultra-high-speed rotation... and more.
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Applications/Examples of results
For more details, please refer to the materials. Feel free to contact us as well.
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We are a development-oriented company that designs and develops a unique rolling-type rotary connector, which differs from conventional slip rings and mercury types, and we are continuously working on their improvements. The rolling-type slip ring features a one-of-a-kind structure globally, with low contact resistance, low noise, and low rotational torque. It is also capable of conducting high-frequency currents of 13.57 MHz, and we have numerous delivery records to major semiconductor manufacturers. To engage in development in a better environment, we relocated our office to the current location in May 2024.