High-precision continuous punching processing of 0.1mm copper foil.

We can handle everything from material input, processing, inspection, to packaging in a clean room. You can also trust us with components for products that are sensitive to foreign substances, such as electronic devices.

Copper foil is primarily a material with a thickness of about 0.01 to 0.2 mm, used for wiring in printed circuit boards and FPCs, battery electrodes, electromagnetic wave shielding, antennas, etc. Additionally, due to its very high thermal conductivity, it is also used as a heat dissipation material. Metal foils such as copper foil and aluminum foil are very thin materials, making them prone to wrinkles, burrs, and cracks during processing, and they are particularly difficult materials for punching. At Otis, we have made it possible to perform punching processing of 0.1 mm copper foil in a roll-to-roll manner, thanks to our original processing equipment and unique know-how in mold design. We have independently established burr-free processing to minimize burrs, which are a concern in punching, and no-crack processing to eliminate edge cracks, allowing for high-precision shape processing. Depending on the lamination method, we can also add tabs and simultaneously produce jigs, and by using half-cut processing for punching, we can deliver rolls that are optimal for automatic mounting. Furthermore, we have production bases in China, Thailand, and Malaysia, where we have introduced the same processing equipment as in Japan, enabling us to achieve the same level of precision. We are also skilled in small-diameter punching processing and in processes that involve laminating polyimide, insulating PET, and other materials with adhesive tape. Please feel free to contact us.

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