Warp compensation solution! An inspection system that combines advanced high-resolution optical components.
"Meister-SPi" is an inspection system that combines vision algorithms with advanced high-resolution optical components for the semiconductor industry. These technologies promise to deliver excellent performance, functionality, and accessibility. Additionally, the inspection capabilities of this product have already been qualified for mass production by major semiconductor foundries in Asia. 【Features】 ■ High-speed camera (12MP) and high-resolution optical system (5um) ■ Capable of inspecting thin solder (down to 10um) ■ Warpage compensation solution *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Available Packages】 ■ Fan-out Package ■ SiP ■ Flip Chip ■ WLCSP 【Specifications】 ＜Accuracy＞ ■ Calibration Jig: Height ±1µm ＜Repeatability (3α)＞ ■ Height ・ Normal substrate: 0.2µm ・ 008004 bump: 0.3µm ■ Area/Volume ・ Normal substrate: <0.3% ・ 008004 bump: <4% *For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■Production site *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Our company values human resources and has practiced sound management as the foundation of our customers' trust, leading to our growth. We cherish the connections between people and have decided to continue existing as a company recognized by our customers for our significance. The world is changing, and at a considerable speed. We are considering letting go of our past successes. Following traditional methods will not create any new value. We will focus our efforts on things that others do not or cannot do, investing all our energy and resources into this. Even if we are small, we aim to become a company that earns greater trust and inspires our customers.
