[Case Studies of Thermal Design and Thermal Design Consulting] Detailed Thermal Design of Circuit Boards
Printed circuit boards are important heat dissipation pathways! Are you considering the impact of the wiring patterns?
We will introduce examples of thermal design and thermal design consulting. The printed circuit board is an important heat dissipation pathway. For small-sized components, most of the heat escapes through the substrate, so it is essential to accurately model the density of the wiring patterns. Therefore, we propose our thermal design support tool specifically for electronic devices, "FloTHERM." It allows for easy modeling of important wiring patterns as heat dissipation pathways with the necessary detail. The wiring patterns of multilayer boards are pixel-divided, and equivalent thermal conductivities are automatically calculated for each area. [Case Study] ■ Issue: Detailed thermal design of the substrate ■ Proposed Product: Thermal design support tool "FloTHERM" for electronic devices ■ Benefits: Easy modeling of important wiring patterns as heat dissipation pathways with the necessary detail *For more details, please refer to the PDF document or feel free to contact us.
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basic information
**Overview** "FloTHERM" is a thermal fluid analysis tool that can be applied to various electronic devices, from entire systems to individual semiconductor packages. To enable thermal designers to use it efficiently, it incorporates various features such as intuitive model creation, instant mesh generation, and result processing functions focused on thermal design. Tools such as "FloTHERM PACK," which supports the modeling of semiconductor package components, "FloEDA Bridge," which efficiently creates analysis models for circuit boards by importing CAD data, "FloMCAD Bridge," which assists in creating models of enclosures by importing 3D CAD data, "FloTHERM PCB," tailored for electrical and circuit board designers, and "FloTHERM XT," which allows for analysis that faithfully reproduces curved and angled shapes based on 3D CAD, effectively support collaborative design between electrical and mechanical designers through the use of the FloTHERM toolset. *For more details, please refer to the PDF document or feel free to contact us.*
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【Purpose】 ■Detailed thermal design of the substrate *For more information, please refer to the PDF document or feel free to contact us.
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While focusing on MBD and CAE technologies and their surrounding technical areas, we specialize in building virtual products and collaborative design processes through cutting-edge digital engineering. We have formed partnerships with leading software vendors of the era to provide top-level digital engineering technologies in Japan, including solutions for thermal fluid analysis, structural analysis, electromagnetic field analysis, acoustic analysis, system simulation, optimization technologies, embedded software development environments, and simulation process data management (SPDM) solutions. We offer a comprehensive engineering environment necessary to solve the diverse and complex challenges faced by our customers. Official Blog: https://www.idaj.co.jp/blog/ IDAJ YouTube Channel: https://www.youtube.com/channel/UCGCd8pB5Lwq_noIoxpgJrrw/featured X: https://twitter.com/IDAJ_CAE Facebook: https://www.facebook.com/IDAJ.CAE
![[FloTHERM Case Studies] Thermal fluid analysis for all electronic devices.](https://image.mono.ipros.com/public/product/image/06a/2000365918/IPROS2603371555440817275.png?w=280&h=280)
![[dbSheetClient Implementation Case] Nippon Steel Logistics Hirohata Co., Ltd.](https://image.mono.ipros.com/public/product/image/276540/IPROS10461682257069942475.png?w=280&h=280)
