We can respond to the design and implementation of prototype (small quantity) boards for LSI testing at a low cost and with a short delivery time!
The "Test Board Making Service" provides affordable and quick responses for the design and implementation of prototype (small quantity) boards for LSI testing. The initial cost is 0 yen, and by using direct drawing for production, total costs can be reduced by 20-40%. Delivery can be handled in as little as 4 days at the shortest. We also accommodate measures against crosstalk and high current application. If you have any other requests, please feel free to contact us. 【Features】 ■ Affordable and quick responses for design and implementation ■ Initial cost is 0 yen; produced using direct drawing ■ Total costs reduced by 20-40% ■ Capable of addressing crosstalk measures and high current application *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 ■ Pad pitch: 0.24 mm (minimum) ■ Land diameter: 0.18 mm ■ Total number of pads: approximately 1,000 (□16×16 mm) proven ■ Impedance control: 50/75/100Ω ±10% ■ Board thickness: 1.0 to 5.0 mm ■ Number of layers: 26 Layers (proven) ■ Board material: FR-4/FR-5 ■ Surface finish: Electroless thick gold plating/Flash gold plating/Solder leveling/Heat-resistant preflux ■ Equal length wiring: within 0.15 ns (other options available) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Mikunas Fine Engineering has been driven by a passion to exceed customer expectations since its founding in 1949. We have continuously applied our ingenuity and creativity to meet various needs. We thoroughly respond to a wide range of requests, from precision parts processing to equipment assembly, and we support our customers in every aspect.