Improved processing efficiency. Dicing processing with high precision and low cost. Excellent operability.
The ADT-made "8020 Series" is a fully automatic dicing machine capable of cutting semiconductor wafers with a diameter of up to 8 inches with high precision and low cost. With twin spindles arranged to face each other, simultaneous dicing is possible, contributing to high processing efficiency. It features two touch screens for the main display and maintenance, equipped with an intuitive user interface for easy operation. 【Features】 - Supports hub/hubless blades up to 3" O.D. - High-power spindles of 1.8kW or 2.4kW - Excellent vision system with continuous zoom - Improved throughput with high-speed automatic alignment and cutting positioning *For more details, please refer to the materials. Feel free to contact us as well.
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【Main Features】 ■ Air bearing feed axis (X) ■ Automatic calf inspection and quality analysis for high precision ■ Process data logging and statistical analysis ■ High-speed and simple blade exchange with lock spindle axis ■ SECS/GEM platform compatible ■ Full access to all areas of the system
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【Applications】 ■ Silicon wafers / Discrete devices ■ Silicon carbide (SiC) ■ MEMS ■ SAW devices ■ Glass wafers ■ Packaging (QFN, LED, etc.) *For more details, please refer to the materials. Feel free to contact us as well.
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