Filling holes on pads is possible for a board thickness of up to 4.8t! We support the manufacturing of BGA and CSP areas.
"Pad on Via" is a printed circuit board that supports the manufacturing of BGA and CSP areas. The filling of Pad on Via holes can accommodate a board thickness of up to 4.8t, with drill diameters ranging from φ0.105mm to φ1.0mm. (Consultation available depending on specifications) Additionally, we can achieve permanent filling of vias according to customer requests. The permanent filling ink is processed smoothly through polishing. 【Process Example】 ■ NC drilling ■ Primary copper plating ■ Hole filling ■ Curing and polishing ■ Secondary copper plating ■ Pattern formation *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications (Partial)】 ■ Board Thickness - Selectable: 0.4t or more and 4.8t or less - All vias: 0.4t or more and 2.0t or less ■ Drill Diameter: φ0.105mm to φ1.0mm or less (Consultation available depending on specifications) *Specifications may vary depending on the number of holes, hole diameter, hole pitch, etc., so please refer to the PDF document for details or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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The screen process strives to meet various customer needs by pursuing high quality, high precision, and short delivery times, while also accurately responding to the demand for lower prices. Furthermore, we aim to deliver products that anticipate future directions and contribute to a prosperous future.