Information on various materials that can be handled and manufacturing conditions that can be accommodated by our company.
This is an introduction to various materials and manufacturing conditions that we can handle. For specifications not listed, please feel free to consult with us. 【Printed Circuit Board Specifications】 ＜Minimum L/S＞ ■ Outer layer 18μm: 100/100μm ■ Outer layer 35μm: 150/150μm ■ Outer layer 70μm: 250/250μm ■ Outer layer 12μm: 80/80μm (pad-on-via mixing not allowed) ■ Inner layer 35μm: 80/80μm ■ Inner layer 70μm: 200/200μm *For more details, please refer to the PDF document or feel free to contact us.
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【Other Printed Circuit Board Specifications】 <Manufacturable Layers and Board Thickness> ■ Layers: Single-sided, Double-sided, Multi-layer (3 to 30 layers) ■ Board Thickness: 0.1t to 4.8t <Available Materials> ■ General FR-4 ■ CEM-3 ■ High Tg Halogen-free ■ Halogen-free ■ Low Dielectric Material ■ Aluminum Base Substrate ■ Bake ■ High Tg ■ Modified Polyimide <Available Drill Diameters> ■ Minimum drill diameter for through vias: φ0.25mm ■ Minimum drill diameter for pad-on-via: φ0.105mm ■ Maximum drill diameter: φ6.35mm <IVH> ■ Maximum IVH interlayer thickness is 0.4t, minimum hole diameter can be φ0.1mm ■ Supports sequential IVH as well <Surface Treatment> ■ Water-soluble heat-resistant flux ■ Gold plating (flash, electrolytic, electroless thickening, electroless Ni/Pd/Au) ■ Solder leveling (eutectic, lead-free (Sn-Ag-Cu type)) ■ Terminal gold plating (electrolytic hard gold plating) ■ Electroless tin plating *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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The screen process strives to meet various customer needs by pursuing high quality, high precision, and short delivery times, while also accurately responding to the demand for lower prices. Furthermore, we aim to deliver products that anticipate future directions and contribute to a prosperous future.
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