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  5. Printed Circuit Board
  6. Substrate for narrow pitch BGA/CSP and PGA specification high-density substrate

Substrate for narrow pitch BGA/CSP and PGA specification high-density substrate

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last updated:Oct 01, 2010

スクリーンプロセス
スクリーンプロセス
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There are various variations depending on the board thickness and pitch.

There are various variations depending on the thickness of the board and the pitch.

    Printed Circuit Board
bga1.jpg

Substrate for narrow pitch BGA/CSP and PGA specification high-density substrate

bga1.jpg
bga1.jpg

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basic information

【Features】 〇 We can manufacture substrates with 0.35mm pitch BGA/CSP, 0.40mm pitch BGA/CSP, 0.50mm pitch BGA/CSP, 0.65mm pitch BGA/CSP, 0.50mm pitch PGA, and 0.65mm pitch PGA. 〇 There are various variations depending on the board thickness and pitch. 〇 For details on design values, please contact us. ● For other functions and details, please contact us.

Price information

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Delivery Time

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Applications/Examples of results

【Applications】 〇 Printed circuit boards (multilayer boards, BGA/CSP high-density boards, flat through-holes, aluminum boards, and other special wiring boards for consumer and industrial use prototype manufacturing) 〇 Laser drawing, CAM editing, precision industrial photography, complete screen printing ● For other functions and details, please contact us.

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Screen Process Co., Ltd. Company Profile

Screen Process Co., Ltd. Company Profile

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スクリーンプロセス

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The screen process strives to meet various customer needs by pursuing high quality, high precision, and short delivery times, while also accurately responding to the demand for lower prices. Furthermore, we aim to deliver products that anticipate future directions and contribute to a prosperous future.

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