Introducing a multilayer metal base substrate that supports high-density wiring!
The "Multi-layer Metal Base Substrate" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. By laminating double-sided printed circuit boards and multi-layer printed circuit boards onto a metal surface with an insulating layer or a high thermal conductivity insulating sheet, it enables higher density wiring and component mounting compared to single-sided metal base substrates. 【Features】 ■ Metal substrate compatible with high-density wiring *For more details, please refer to the PDF document or feel free to contact us.
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If you need UV LEDs or high-brightness LED substrates, trust Arrow Industries! - We welcome inquiries about substrates from the development stage! - We can handle prototype and small lot production of special substrates! - For heat dissipation substrates (thick copper, aluminum/copper base, copper bumps, etc.), come to Arrow Industries; we can also handle assembly. - Research and development of high-reflective resist coatings to prevent degradation from ultraviolet light. Over 20 years of experience in the design and manufacturing of special substrates and heat dissipation substrates. We provide a consistent service from printed circuit board design and manufacturing to component assembly. We flexibly accommodate prototype boards and a variety of small lots, so please feel free to request materials or inquire for quotes.