Favorable for thin, compact, and narrow-pitch substrates! Introducing examples of build-up substrate manufacturing.
We would like to introduce an example of our "build-up substrate" manufacturing. By using non-through vias connected by laser, it is advantageous for achieving thinner, smaller, and narrower pitch substrates. Please feel free to contact us when you need assistance. 【Overview】 ■ 3-layer build-up (full stack) ■ Any layer (core via file) *For more details, please refer to the PDF document or feel free to contact us.
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Our entire staff takes responsibility and consistently manufactures all processes of printed circuit board production in our own factory, enabling us to respond to short delivery times that others cannot achieve. We provide a wide variety of printed circuit boards, from single-sided to high multilayer, for applications such as musical instruments, toilets, mobile phones, automotive, and space development. We possess state-of-the-art equipment and can also accommodate short delivery times for high-difficulty boards and flexible boards. Our motto is "Change & Challenge." We are not afraid of transformation and will continue to challenge ourselves! Please feel free to contact us with your requests. Remote face-to-face meetings are also possible!
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