Numerous application results of 1005CR! 'Seal-glo Chip Adhesive'
Seal-glo NE7200H・NE7300H・NE3000S・NE3300H・NE7250H・NE8800K/T
An epoxy-based adhesive developed as a temporary fixing agent for chip components! It reduces the burden on electronic components with low-temperature curing at 90°C for 90 seconds.
Solve the problem of component drop due to chip component miniaturization! We achieve fine coating that overturns conventional wisdom. With 'Seal-glo Chip Adhesive', fine coatings such as 1005CR, which are difficult for other companies, can be applied smoothly without clogging the dispenser or mask openings! We have received numerous inquiries due to the trend of component size reduction. 【Benefits】 - No issues with 1005CR bond application (dispenser/printing) - Proven application for 0603CR bond (dispenser) - Confirmed discharge capability with a nozzle inner diameter of Φ0.075mm - Achieved low-temperature curing at 90℃ for 90 seconds - Stable and moderate height coating shape due to thixotropy - High adhesive strength, excellent storage stability, and moisture resistance - Extensive export experience both domestically and internationally - Resin mask contracting is also possible Compared to other chip adhesives currently in use, 'Seal-glo Chip Adhesive' offers many cost advantages, and there are many cases where it results in VA/VE. We encourage you to consider Fuji Chemical Industry's 'Seal-glo Chip Adhesive' at this opportunity. *For details, please contact us or download the catalog.
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basic information
The Seal-glo NE series is an adhesive developed for the temporary fixation of chip components used in surface mounting (SMT) and is a one-component, heat-curing epoxy adhesive with excellent storage stability. (It also complies with the RoHS directive.) Packaging forms: Cartridge type (200g) Syringe type (various) Please inquire about the syringe type. If you provide the name of the dispenser manufacturer, we will supply you with the most suitable syringe. Additionally, if you inquire about overseas supply, we can introduce you to a local distributor.
Price information
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Delivery Time
P3
Applications/Examples of results
Achievements: Various electrical manufacturers and EMS companies (domestic and overseas)
Line up(3)
Model number | overview |
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NE7200H・NE7300H | High-speed dispenser compatible grade Metal screen and plastic plate printing are also possible Base grade: NE7200H Low-temperature curing type: NE7300H |
NE7250H・NE3000S・NE3300H | Grade exclusively for printing machine application (can be applied with solder printing machines) Metal screen and plastic printing plate |
NE8800K/ 8800T | Dispenser exclusive part number Basic type: 8800K Part number for high temperature and high humidity regions: 8800T |
catalog(3)
Download All CatalogsCompany information
Fujikagaku Industry aims to contribute to society through engineering services in the field of substrate mounting, utilizing fine chemical technologies related to adhesives, coatings, potting, and printing, as well as resin processing technologies centered on precision extrusion molding of engineering plastics as key technologies. Our company is characterized by comprehensive knowledge of peripheral chemicals such as adhesives and surface treatments, knowledge and sales performance of materials necessary for substrate mounting, and a sales structure specialized in the electrical, mechanical, and automotive electrical industries, enabling us to provide well-informed responses and proposals. We also have catalogs and product introductions available on our website, so please take a look. Additionally, we are flexible in responding to requests for products not listed on our website, so feel free to contact us with your needs.