3Ag, compatible with both low Ag! Excellent workability and low scattering.
- Good wettability even with low Ag The "EVASOL MFJ series" has improved wettability significantly, making it compatible with low Ag alloys. It allows for cost reduction while maintaining work efficiency comparable to 3Ag. - Reduced splatter The base material is selected according to the melting point increase of the solder alloy. This results in less splatter and enables higher quality mounting. - Excellent wettability retention By combining surfactants, the retention of wettability has improved. Stable mounting is possible regardless of the size or type of components. 【Features】 ■ Excellent wettability even with low Ag ■ Minimal splatter ■ Improved wettability characteristics *For more details, please refer to the PDF document or feel free to contact us.*
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basic information
【Specifications】 ■ Compatible solder alloys: J3 (Sn-Ag3.0-Cu0.5), R4 (Sn-Ag0.3-Cu0.7), R8 (Sn-Cu0.7) ■ Compatible flux amounts: 3±0.3, 4±0.3, 6±0.3% ■ Flux types: JIS-A, MIL-RMA ■ Halide content: 0.08 to 0.14% ■ Insulation resistance: 5.0×10^8Ω or more ■ Wire diameters ・J3: 1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.2, 0.15, 0.1 ・R4: 1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.2 ・R8: 1.6, 1.2, 1.0, 0.8, 0.6, 0.5, 0.4, 0.3, 0.2 * For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
- Soldering of vehicle-mounted connectors and through-hole boards - Soldering to copper and nickel components - Robotic soldering
Detailed information
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- Good wettability even with low Ag The "EVASOL MFJ series" has significantly improved wettability, making it compatible with low Ag alloys. It allows for cost reduction while maintaining work efficiency equivalent to that of 3Ag.
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- Reduce scattering Select base materials according to the melting point increase of the solder alloy. This allows for less scattering and enables higher quality assembly.
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- Excellent wetting durability By combining surfactants, the durability of wetting has improved. Stable implementation is possible regardless of the size or type of components.
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Company information
Ishikawa Metal Co., Ltd. is a manufacturer and seller of lead-free and lead-containing solder, consistently engaged in solder production since its establishment. In addition to various types of rosin-core solder and solder paste, we also handle high-melting-point solder for semiconductors and flux for semiconductor mounting. We not only manufacture and sell unique solders, such as rosin-core solder for lasers and solder that can be used for aluminum and stainless steel, but we also propose solutions to customer issues such as splattering and wetting defects.