Introducing K.Y. Electronics' efforts in the "solder dip process"!
We would like to introduce the solder dip process that K-Y Electronics is working on. Our company maintains uniformity for each lot by documenting the solder conditions for each product in the product file. For flux management, we use a spray method for both eutectic and PBF, and we also implement uniformity in concentration and quantity. 【Method】 ■ Both sides of the W reflow substrate are masked and use solder DIP fixtures. ■ Avoid hand soldering. ■ Achieve uniform solder rise through DIP. *For more details, please refer to the PDF document or feel free to contact us.
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【Equipment】 ■ PBF automatic soldering machine ■ Uses an N2-compatible flow tank that significantly improves solder wettability (Also available for Kyoshou) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company is engaged in assembly operations in Osaka. Although we are a small town factory, we can produce everything from SMT assembly to unit assembly. In particular, we are capable of high-density and narrow-pitch CSP assembly. We can also inspect BGA and other components using X-ray inspection equipment. Most of our orders are for small lot items (around 50 to 1,000 units), so we do not seek large lot orders (such as tens of thousands of units). Because we focus on small quantities, we have abandoned the idea of reducing defects at each process and repairing finished products later. Instead, we prioritize high-quality production by carefully selecting solder based on the opening and difficulty of each component during mask creation. Please take a look at our website for an overview of our company and detailed equipment information.