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  5. Soldering Equipment
  6. Automatic Post-Assembly Soldering Device "MD-2000"

Automatic Post-Assembly Soldering Device "MD-2000"

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last updated:Aug 16, 2021

森永技研
森永技研
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An automatic soldering machine that quickly adopted lead-free technology with consideration for the environment!

The "MD-2000" is an automatic soldering device that allows for point soldering after the installation of radial, axial, and transformer components on soldered surfaces. Even beginners can easily solder by simply setting the circuit board and pressing the start button, thereby speeding up the work process. 【Features and Benefits】 ■ Automation: Cost reduction, labor saving, and increased productivity ■ Compact and lightweight: Space-saving and can be set up anywhere ■ Lead-free: Environmental protection and improved corporate image ■ Multi-point soldering: Suitable for connectors, components, and other soldering tasks *For more details, please download the PDF or feel free to contact us.

    Soldering Equipment
自動後付け半田装置『MD-2000』.PNG

Automatic Post-Assembly Soldering Device "MD-2000"

自動後付け半田装置『MD-2000』.PNG
自動後付け半田装置『MD-2000』.PNG
  • Related Link - http://morinaga-giken.jp/home/development/index.ht…

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【Specifications】 ■ Power Supply: AC100V 50/60Hz 950W ■ Fuse: 15A ■ Heater Capacity: 450W × 2 series heaters ■ Jet Motor: 25W variable speed induction motor ■ Jet Flow: Continuously variable (volume) ■ Operating Temperature Range: Adjustable from 200℃ to 350℃ ■ Temperature Detection: CA-K type thermocouple ■ Temperature Control Weekly Timer: Uses memory relay (high functionality type) ■ Solder Capacity: Approximately 20Kg ■ Dimensions: 280W × 550D × 250H ■ Weight: Approximately 20Kg (excluding solder) ■ Options: Jet nozzle, masking jig (available for separate order) ■ Soldering Area: 180mm × 150mm *For more details, please download the PDF or feel free to contact us.

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Automatic Post-Assembly Soldering Device 'MD-2000'

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森永技研

森永技研

Industrial Machinery

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Our company consistently carries out manufacturing from the assembly of electronic components to the final assembly. We have developed our own compact, space-saving tabletop MINI DIP (Mini Dip) device, the "Automatic Small Soldering Machine," which dramatically improves the efficiency of soldering work and reduces costs, along with the MINI FLUX (Mini Flux) device, the "Automatic Flux Application Machine," which is used in conjunction.

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